Wafer Grinding
Maximum wafer-machining diameter of wafer Ø4” to Ø8” (universal sizes available)
Grinding Spindle: Bearing type: Air bearing, maximum 3600 rpm
Motor:2.2 kw, 4P, high frequency motor
Rapid feed speed:200 mm/min
Grind feed speed:1 to 999 μm/min
Grinding wheel size:Ø250 mm
Number of Cassettes:2 stations (option for 3 stations)
Programming method:Color 17” GUI touch screen
For more information, Please contact us.
building 6, Nanfang Urban Park, Lane 1165, Jindu Road, Minhang District, Shanghai,China.
302, 3rd Floor, Building B, Kaicheng High tech Park, Dalang Street, Longhua District, Shenzhen, China